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3D Microelectronic Packaging (From Architectures to Applications) (2nd Edition)
$19.99
Download 3D Microelectronic Packaging (From Architectures to Applications) (2nd Edition) written by Deepak Goyal Yan Li in PDF format. This book is under the category Technology & Engineering and bearing the isbn13 numbers 9811570892/9789811570896. You may reffer the table below for additional details of the book. We do NOT provide access codes, we provide eBooks ONLY. Instant access will be granted as soon as you complete the payment.
Additional information
| book-author | Deepak Goyal Yan Li |
|---|---|
| publisher | Springer |
| file-type | |
| pages | 639 |
| language | English |
| isbn10 | 9811570892 |
| isbn13 | 9789811570896 |
| year | 2021 |
Specifications
| book-author | Deepak Goyal Yan Li |
|---|---|
| publisher | Springer |
| file-type | |
| pages | 639 |
| language | English |
| isbn10 | 9811570892 |
| isbn13 | 9789811570896 |
| year | 2021 |
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